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SDBG技术在超博Wafer切割过程中的应用

In package assembly and test area, the mechanical strength of ultra-thin die is critical on both the process and the reliability to ensure high assembly yield and good package reliability, especially in stack-die package structure.

方案概述

Background

In package assembly and test area, the mechanical strength of ultra-thin die is critical on both the process and the reliability to ensure high assembly yield and good package reliability, especially in stack-die package structure. Thus, it is very important to make sure a suitable wafer thinning and separation process to be selected for ultra thin die, which is less than 30um to meet 8 dies stacked and even 16 dies stacked. This paper introduced wafer thinning and dicing process respectively, including DAG, LAG, DBG and SDBG process.

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Summary and Conclusion


DAG method has high difficulties and risks to handle die thickness being less than 30um, this is mainly due to the limitation of its blade dicing process. DBG process can handle 25um die thickness, but top surface chipping of the die cannot be avoided which is again due to its blade dicing process. And it is also noted that after separation by DBG, its final DAF size is a little larger than the die size itself. 


LAG can help to reduce top side chipping issue significantly, however its laser power may burn the DAF tape and cause it sticking to wafer mount tape, which will induce high risk for picking up process. 


Actually SDBG is an improved version of DBG process, which uses laser ‘stealth dicing’ to create wafer separation from top surface instead of half-blade sawing process used in DBG. Almost zero chipping can be achieved by SDBG. This perfect separation can allow much narrower saw streets on wafer layout design, which may allow higher die qty per wafer in future. However, due to its DAF separation is done by expansion process, there is limitation for die size handling by SDBG. When die size is smaller than 2.5mmx2.5mm, the difficulty of DAF tape separation might be encountered. Further evaluation is needed for its die size handling limitation.

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