From September 1 to 3, 2021, Shenzhen International Convention and Exhibition Center (Bao 'an Pavilion) will welcome an audio-visual feast, with a total area of 200,000 + and 130,000 + visitors. No. 8 "SiP and Advanced Sealed Test /TWS/AIOT Technology Pavilion" will showcase a complete wafer-level SiP advanced packaging production line for the first time, booth No. 8G46.

KANA will join hands with the industry's top equipment suppliers and partners to show the real production process for the audience. The professional technical team will lead the audience to visit and explain the whole process, so that the audience can intuitively understand the industry's latest SiP advanced packaging technology, equipment and materials.

SiP DEMO LINE

Organizer:

Exhibition introduction:

ELEXCON Shenzhen International Electronics Fair and Embedded Systems Fair will give full play to the advantages of local resources and promote the shared development of the whole industrial chain of China's electronics. 2021 will be themed "Focusing on electronic technology innovation and industrial chain remodeling". New technologies, products and solutions in 5G, AIoT, big data, embedded technology, medical electronics, intelligent automotive technology, intelligent manufacturing, Beidou satellite and other fields will be comprehensively displayed. Exhibitors from more than 20 countries and regions around the world will be gathered. Dozens of professional technical forums will be held at the same time, and over 100 global industry think tanks and experts will be invited to give speeches.