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Vice Premier Liu He surveyed integrated circuit enterprises and presided over a symposium
October 8 news, yesterday morning, a total investment of 5.3 billion yuan Rui Hui new display and semiconductor project in Yancheng Yannan high-tech Zone Xifuhe science and technology corridor construction started.
近日，据报道，意法半导体(ST) 将在意大利建造一座价值7.3亿欧元（约合人民币50.28亿元）的碳化硅晶圆厂。 此前，为了提高欧洲的生产能力，欧盟于2月推出了《芯片法案》，欧盟拟动用超过430亿欧元的公共和私有资金，用于支持芯片生产、试点项目和初创企业。通过增加投资、加强研发，扩大欧盟芯片产能在全球市场占比，并防止对国际市场过度依赖。 意法半导体表示，新的集成碳化硅 (SiC) 基板制造设施将满足汽车和工业客户在向电气化过渡期间不断增长的需求。这项为期五年的投资将于2026
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