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The storage density of Flash Memory storage devices continues to rise, the chip production process nodes are constantly updated, and the process within 20 nm is becoming more and more common in the manufacturing of memory devices, and the continuous expansion of line width brings challenges to manufacturing
View MoreA wafer probe is a machine used to test integrated circuits (automatic test equipment).
View MoreMEMS devices utilize semiconductor processing techniques to manufacture three-dimensional mechanical structures, and the three most commonly used MEMS manufacturing techniques include Bulk Micro Machining, Surface Micro Machining, and LIGA.
View MoreSiC is mainly used to achieve small weight and lightweight drive systems such as electric vehicle inverters. The advantages of SiC devices over Si devices are lower energy loss, easier miniaturization and higher temperature resistance. SiC is suitable for high pressure field, GaN is more suitable for low pressure and high frequency field.
View MoreIn the entire semiconductor industry chain, semiconductor materials are in the upstream, the middle reaches are all kinds of semiconductor components, and the downstream applications include consumer electronics, communications, new energy, power, transportation and other industries. In recent years, with the second and third generation compound semiconductors achieving more extensive applications with their unique physical properties, their upstream substrate materials gallium arsenide, silicon
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