On September 29, 2021, the first wafer-level SiP Advanced Packaging production line and conference of Kaiyi Technology was successfully concluded in ELEXCON 2021.

With an exhibition area of 60,000 square meters, ELEXCON 2021 attracted more than 40,777 professional visitors to visit and exchange views. This exhibition lasts for three days, SiP advanced packaging production line level assembly on-site audience stream, not affected by the epidemic factors.

Entrance to exhibition and wafer level packaging production line

KANA Technology is invited as the technical partner of Shenzhen International Electronics Fair (ELEXCON 2021) to join hands with: Leading equipment manufacturers such as Curisofa, ITW, PARMI, Heller, Processus, Star Technology, Enosi, etc. jointly built a 400 square meter wafer level SiP advanced packaging production line at the exhibition site to share the latest process technology with the industry. At the same time, the team of academician Wang Xujin from Shenzhen University was invited to discuss the development trend, challenges and solutions with the industry.

Production line construction and some equipment

SiP advanced packaging production line and conference site, the audience actively exchange interaction

ELEXCON  is one of the bellweds of Chinese industry, and it is also a one-stop platform for engineering R&D, procurement and decision-making personnel in the field of technology application to explore the direction of the industry. As the technical partner of ELEXCON Technology Show, we will strive for excellence and continuous innovation, hoping to make a contribution to the development of the industry together with Elexcon Electronics Show.

The first wafer-level SiP Advanced packaging production line and conference were highly praised, but wonderful to be continued, let's meet on September 14-16, 2022, the second packaging production line.