September 15-17, 2022 Shenzhen ELEXCON 2022 will be opened in Shenzhen Futian Convention and Exhibition Center soon! As the technology partner of ELEXCON 2022, KANA will join hands with the industry's top equipment suppliers to build a complete wafer-level SiP advanced packaging production line. The 540 square meter exhibition area will be used to organize speech forums together, forming interaction between the forum and the production line.
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Expo: Shenzhen International Electronics Fair (Excel 2022)
Time: November 5-7, 2022
Venue: Shenzhen Futian Convention and Exhibition Center, Hall 9, 9L32
Scale: more than 40,000 offline employees
The Shenzhen International Electronics Show has witnessed the growth of the system-level encapsulated SiP sector, with advances in SiP assembly, testing and materials forming the heart and soul of the new generation of SiP platforms. At the same time, the conference has been focused on the new progress of SiP technology, and promote the exchange of high-end technology and packaging industry chain interaction, the exhibition scope covers OSAT sealed test services, 3D IC design /EDA/IP tools, semiconductor equipment and advanced processes, advanced materials, Mini-Led packaging and SiP advanced production line display.
Wafer level SiP advanced packaging production line
In the wafer level SiP advanced packaging production line exhibition area, the professional technical team of the field equipment supplier will explain the equipment condition one by one and combine with the visual production demonstration to answer questions and doubts face to face and respond to the practical application problems encountered by users on the production line in real time, bringing immersive interactive experience to the audience and providing more advantageous solutions for the upstream and downstream enterprises. At the same time, one of the biggest highlights of this year's conference is to invite the world's top equipment suppliers to share cutting-edge technology and market development direction, so that the audience can intuitively understand the industry's latest SiP advanced packaging technology, equipment and materials.
Five functional exhibition areas
This time, we also set up five special functional exhibition areas, which are equipment exhibition area, enterprise negotiation area, forum speech area, VIP cafe area and tea break area, to provide you with more convenient exhibition experience.
List of exhibitors
The exhibitors are (in no particular order) : ITW, PARMI, K&S, Shenzhen Silikang Technology Co., LTD., Shenzhen Dachu Semiconductor Equipment Technology Co., LTD., JCA (Jiangsu Jingchuang Advanced Electronic Technology Co., LTD.), Zhuhai Hengge Microelectronics Equipment Co., LTD., Shenzhen Yongxinda Technology Co., LTD., Shenzhen Jiawang Industrial Equipment Co., LTD., Shenzhen Devo Advanced Automation Co., LTD.
LIST
As a leading provider of microelectronics manufacturing solutions, Kaiyi has been supporting the development of semiconductor industry in China. In 2022, Kaiyi Technology will participate in Shenzhen International Electronics Fair again, integrate all resources, cooperate with top suppliers in the industry, and make concerted efforts to maximize advantages, efficiency and value.
