Shenzhen ELEXCON 2022 was successfully held in Shenzhen Convention and Exhibition Center (Futian) from November 6th to 8th, lasting for 3 days. Shenzhen KANA Technology Co., Ltd. and 10 enterprises appeared in this exhibition. Build a wafer-level SiP advanced packaging production line on site, and invite the world's top equipment suppliers to share cutting-edge technology and market development direction.
Exhibition highlights
As an international event for the electronics manufacturing industry, ELEXCON 2022, as an annual event for the electronics and embedded industry, has attracted the attention of many industry professionals. 5G new technology and application, vehicle scale chips and components, embedded and AloI, SiP and advanced closed test, four major topics quickly introduced into the new Blue Ocean,20+ class, 400+ quality suppliers.
KANA & Fab level SiP advanced packaging production line appeared at Booth 9L32 in Hall 9. Many visitors came to visit and consult, pay attention to the trend of closed test industry, understand the solutions provided by KANA , and even have a good talk with the big names of the school and production line technology. They shared the current situation of the industry, market conditions, and discussed the future hot spots and trend development.
KANA & Fab level SiP advanced packaging production line appeared at Booth 9L32 in Hall 9. Many visitors came to visit and consult, pay attention to the trend of closed test industry, understand the solutions provided by KANA , and even have a good talk with the big names of the school and production line technology. They shared the current situation of the industry, market conditions, and discussed the future hot spots and trend development.
