In this exhibition, as the technology partner of ELEXCON 2022, KANA, together with 10 leading equipment suppliers in the industry, set up a wafer level SiP advanced packaging production line at 9L32, Hall 9, Shenzhen Convention and Exhibition Center (Futian). The booth became one of the focal points of the exhibition, attracting a large number of visitors to stop for consultation and exchange. At the same time, the supplier's professional technical team explains the equipment condition one by one and combines with the visual production demonstration to answer questions and answer doubts face to face.
     At the same time, KANA invited the world's top equipment suppliers to share cutting-edge technology and market development direction, so that the audience can intuitively understand the industry's latest SiP advanced packaging technology, equipment and materials.

ELEXCON 2023 Shenzhen International Electronics Fair and Embedded Systems Exhibition will be held in Shenzhen Convention and Exhibition Center (Futian) from August 23 to 25. Among them, the exhibition hall of embedded system and AIoT will show all aspects: AI processor, MCU/MPU, DSP, RISC-V; Analog chip, memory, module; Wireless technology; Open source hardware, industrial computer/board card; Product technologies such as operating systems, software and tools. The site will also build "four solution areas", focusing on edge AI, intelligent industry and industrial interconnection, intelligent medical, intelligent retail and other popular application areas of the landing plan.
     Next year, KANA will continue to work with leading equipment suppliers to build a wafer-level SiP advanced packaging production line in Shenzhen Convention and Exhibition Center (Futian).

Please stay tuned to the official announcement of KANA  for more details of future exhibitions. If you have any questions, please contact us.