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The TSV packaging process of CIS (CMOS Image Sensor) is a silicon through hole process belonging to the narrow concept of TSV. Through silicon perforation, the upper and lower lines are connected to achieve the purpose, and it has not risen to the height of 3D integration, which is different from the concept of TSV system integration mentioned by SiP in the industry. But CIS packaging is an important part of the sealing process at present
View MoreWafer-level packaging (WLP) is the packaging process in which most of the process is operated on the wafer (large wafer), the demand for wafer-level packaging (WLP) is not only subject to the requirements of smaller package size and height, but also must meet the requirements of simplifying the supply chain and reducing the overall cost, and improving the overall performance.
View More5G has brought telecommunication technology to theupsurge and it has become the center of many hot topics since 2018, suchas IoT, AR/VR, Cloud, Big data, AI, Smart city and smart life, andautonomous vehicles … Fast data transfer and low latency......
View MoreSiP's shorter development cycle speeds up time-to-market, which is one of the important reasons why SiP products are accepted by customers
View MoreSiP technology was proposed in the 1990s, has been accepted and flourished in the industry for more than 20 years, and still has a large space for development in the foreseeable future.
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