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Compared to flip packaging technology, fan-out packaging has a smaller surface area, no substrate and intermediary layer, reduced thickness, increased pin number density, lower thermal impedance, better electrical performance, and higher potential system-level packaging and 3D integration capabilities to better meet the end market needs for product performance and volume.
View MoreSiP is an important implementation path beyond Moore's Law.
View MorePower Amplifier (PA, Power Amplifier), is an important part of various wireless transmitters, is one of the most important RF front-end devices. The power of the radio frequency signal generated by the modulating oscillation circuit is amplified to output to the antenna for radiation. The performance of PA directly determines the communication distance, signal quality and standby time of the wireless terminal, and is also the largest power consumption device in the RF front-end.
View MoreFlexible circuit boards, commonly known as soft boards or FPC, are printed circuits made of flexible insulating substrates. It is portable and flexible, and is widely used in folding mobile phones, monitors, laptops, medical wearables and other electronic devices.
View MorePower semiconductor devices are also known as power electronic devices or power devices, it is a special switch with power management capabilities including frequency conversion, variable voltage, variable current, power management, etc. It has a wide range of applications in consumer electronics, new energy, electric vehicles, industrial manufacturing and other fields. Since 2022, the global IGBT devices are in short supply, and the market size of China's IGBT industry is expected to reach 29.0
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